PCB OSP Surface Finish Machine

The PCB OSP (Organic Solderability Preservative) Surface Finish Machine is advanced, eco-friendly equipment used for the final surface treatment of single and multi-layer PCBs. This machine applies a chemical treatment to form a protective film on the copper surface, enhancing anti-oxidation and solderability while maintaining an environmentally friendly process. Ideal for high-quality PCB production, it efficiently handles chemical formulation and precise application to ensure lasting performance and reliability.

Process Flow:

Feeding → Chemical Washing → Recycle Water Washing 1/2 → Running Water Washing → Micro-Etching → Pump Washing → Acid Washing → Recycle Water Washing 3/4 → DI Washing → Blot Up → Anti-Oxidation → Blot Drying → Recycle Water Washing 5/6/7 → DI Washing → Blot Up → Cold Wind Drying → Hot Wind Drying → Discharge

Technical Specifications

– Machine Dimensions: L14535 x W1600 x H1980 mm
– Working Height: 900 mm
– Working Width: 650 mm
– Wheelbase: 35 mm
– Running Speed: 0.5–5 m/min
– Power Supply: 380V, 50 Hz, three-phase
– Total Power: 50 kW
– Minimum Board Size: 120 x 80 mm
– Board Thickness: 0.4–3 mm
– Water Consumption: 24–36 L/min

This OSP machine is an essential tool in PCB manufacturing for ensuring oxidation resistance and reliable solderability, widely applicable across electronics, automotive, telecommunications, and LED industries.