OSP

OSP Line (Organic Solderability Preservative Line)

An OSP (Organic Solderability Preservative) line is a production line in PCB manufacturing used to apply an organic layer to the copper surface of a board. This thin, protective coating preserves the copper’s solderability by preventing oxidation, making it an eco-friendly alternative to other finishes like HASL. The OSP process involves cleaning, micro-etching, rinsing, and coating the PCB to ensure a high-quality, solderable surface.

OSP lines are ideal for applications where a flat, lead-free finish is required, and are widely used in industries such as consumer electronics, automotive, telecommunications, and LED production.