Photo-Chemical Etching Machine Description

The photo-chemical etching machine is a high-precision device designed for various etching applications, including double-sided PCBs, multi-layer PCBs, and copper etching. It is also suitable for chemical milling of precision components such as TV shadow masks, grids, shims, washers, sieves, meshes, SMT choppers, encoders, disks, and more.

Technical Parameters

• Power Supply: 380V / 50Hz / 60Hz
• Working Width: 650 mm
• Working Height: 900 mm (adjustable +/- 50 mm)
• Board Size Range: Minimum 120 x 80 mm / Maximum 650 x 650 mm
• Workpiece Thickness: 0.2 ~ 3.2 mm
• Working Temperature: 35 ~ 55°C
• Conveyor Speed: 0 ~ 6 m/min adjustable
• Heater/Cooling Pipe Material: Titanium
• Machine Dimensions: 12,500 x 1,700 x 1,850 mm

Automatic Control System Includes:

• Working Speed Adjustment: Allows precise control over conveyor speed to ensure uniform etching.
• Pressure Adjustment: Regulates the pressure of the spray and rinsing systems to optimize the etching and cleaning process.
• Temperature Control: Monitors and adjusts the working temperature to maintain consistent chemical reactions.
• High-Temperature Resistant Materials: Features German PP material that withstands temperatures up to 100°C, ensuring durability and reliability.

Process Flow

1. Load: Insert workpieces into the machine.
2. Etching 1 & 2: Initial chemical etching stages.
3. Etching 3 & 4: Additional etching stages for deeper or more intricate patterns.
4. Pressure Water Rinse: Removes excess chemicals and debris.
5. City Water Rinse: Final rinse to clean the workpieces.
6. Checking: Inspection of etched patterns.
7. Stripping 1 & 2: Removal of photoresist material.
8. Pressure Washing: Further cleaning to remove residues.
9. City Water Washing: Additional cleaning stage.
10. Blot Up: Drying of the workpieces.
11. Cold & Hot Dry: Ensures complete drying of the workpieces.
12. Unload: Removal of finished workpieces.

Applications

1. Electronics Industry:
   • PCB Manufacturing: Suitable for producing various types of circuit boards, including double-sided and multi-layer boards, meeting high precision requirements.
   • Component Fabrication: For manufacturing precision electronic components and mechanical parts.
2. Micro-Machining Field:
   • Precision Pattern Creation: Ideal for producing micro grids, shadow masks, and other high-precision patterns used in semiconductor and optical component production.
3. Industrial Uses:
   • Tool and Mold Manufacturing: Capable of etching industrial molds and tools, such as cutting tools and complex mechanical parts.
4. Research and Development:
   • Laboratory Sample Processing: Useful for R&D and laboratory testing where precise material processing is required, offering high precision and controllability.

Working Principle

Photo-chemical etching, also known as photochemical etching, utilizes light-sensitive materials and chemical reactions to achieve precise machining. The process involves applying a photoresist to a copper or other substrate, creating a pattern, and then using chemical etchants to remove the unprotected areas, resulting in the desired design.

The photo-chemical etching machine combines advanced technology with robust design to deliver precise and versatile etching solutions. Its sophisticated control systems and durable materials make it an essential tool for electronics, micro-machining, industrial applications, and research and development.

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