Hot Air Drying Oven for PCB drying solder mask
For effective drying of photoresist, solder masks, and various inks and paints, our Hot Air Drying Oven offers reliable and customizable solutions. Ideal for high-performance PCB manufacturing, this oven ensures optimal drying conditions for your production needs.
Key Features
– Versatile Drying Capabilities:Perfect for drying photoresist, solder masks, and a range of inks and paints used in PCB manufacturing.
– Customizable Size:Our drying ovens can be ordered in sizes tailored to your specific requirements, ensuring a perfect fit for your production line.
– Advanced Structure: The equipment comprises a cabinet, heating system, air circulation system, and control system, all designed to deliver efficient and consistent drying.
Etching Process Flow
1. Metal Surface Printing: Apply photoresist ink to the metal surface.
2. Baking/Drying: Use the hot air drying oven to cure the ink.
3. Exposure: Expose the coated surface to UV light.
4. Developing: Develop the exposed photoresist.
5. Baking/Drying: Perform a final drying step using the oven.
6. Etching: Etch the metal surface to create the desired pattern.
7. Stripping: Remove the remaining photoresist.
Main Technical Parameters
– Power: 12kW / 380V
– Temperature Range: Ambient to 200°C
– Drying Size: 1200mm x 900mm x 1600mm
– Drying Type: Hot Air
Our Drying Oven is engineered to handle large volumes and ensure uniform drying across your products. With its robust design and customizable options, it’s the ideal choice for efficient and reliable drying in PCB production. Contact us today to learn more about how our hot air drying oven can enhance your manufacturing process.
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Email : etchmachinery@gmail.com
WeChat : +86 15010608128
Whatsapp: +86 15010608128
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